may 2006 rev 1 1/10 STTH2002 ultrafast recovery diode main product characteristics features and benefits ultrafast switching low reverse current low thermal resistance reduces switching and conduction losses high t j insulating voltage: 2500 v rms capacitance: 7 pf description single rectifier suited for switch mode power supply and high frequency dc to dc converter. packaged in d2pak, to-220ac and insulated to- 220ac, this device is intended for low voltage, high frequency inverters, free wheeling and polarity protection applications order codes i f(av) 20 a v rrm 200 v t j (max) 175 c v f (typ) 0.86 v t rr (typ) 16 ns part number marking STTH2002d STTH2002 STTH2002di STTH2002 STTH2002g STTH2002 STTH2002g-tr STTH2002 to-220ac STTH2002d to-220acins STTH2002di dpak STTH2002g 2 a a a a k k k k k nc www.st.com
characteristics STTH2002 2/10 1 characteristics to evaluate the conduction losses use the following equation: p = 0.75 x i f(av) + 0.01 i f 2 (rms) table 1. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) rms forward current 35 a i f(av) average forward current, = 0.5 to-220ac, d 2 pa k t c = 120 c 20 a to-220acins t c = 60 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 175 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature 175 c table 2. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ac, d 2 pa k 2 . 4 c/w to-220acins 5 table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 10 a t j = 125 c 10 100 v f (2) forward voltage drop t j = 25 c i f = 20 a 11.1 v t j = 150 c 0.86 0.95 t j = 25 c i f = 25 a 1.15 t j = 125 c 0.94 1.05 t j = 150 c 0.9 1 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 %
STTH2002 characteristics 3/10 table 4. dynamic characteristics symbol parameter test conditions min. typ max. unit t rr reverse recovery time i f = 1 a, di f /dt = -200 a/s, v r = 30 v, t j = 25 c 16 20 ns i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 33 40 i rm reverse recovery current i f = 20 a, di f /dt = 100 a/s, v r = 160 v, t j = 125 c 810 a t fr forward recovery time i f = 20 a, di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 230 ns v fp forward recovery voltage i f = 20 a, di f /dt = 100 a/s, v fr = 1.1 x v fmax , t j = 25 c 2v figure 1. peak current versus duty cycle figure 2. forward voltage drop versus forward current (typical values) 0 20 40 60 80 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i m (a) t d =tp/t tp i m t =tp/t tp i m p = 5 w p = 5 w p = 3 w p = 3 w p = 10 w p = 10 w 0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 2.5 i fm (a) t j =25c t j =150c v fm (v) figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance, junction to case, versus pulse duration 0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 2.5 i fm (a) t j =25c t j =150c v fm (v) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z th(j-c) /r th(j-c) single pulse to-220ac to-220acins d2pak tp(s)
characteristics STTH2002 4/10 figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) 10 100 1000 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 50 100 150 200 250 300 350 400 10 100 1000 q rr (nc) i f = 20 a v r = 160 v t j =125 c t j =25 c di f /dt(a/s) figure 7. reverse recovery time versus di f /dt (typical values) figure 8. peak reverse recovery current versus di f /dt (typical values) figure 9. dynamic parameters versus junction temperature figure 10. thermal resistance, junction to ambient, versus copper surface under tab (epoxy printed circuit board fr4, e cu = 35 m) for d 2 pa k 0 10 20 30 40 50 60 70 80 10 100 1000 t rr (ns) i f =20a v r =160v t j = 125 c t j = 25 c di f /dt(a/s) 0 2 4 6 8 10 12 14 16 18 20 10 100 1000 i rm (a) i f = 20 a v r = 160 v t j =125 c t j =25 c di f /dt(a/s) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ]/q rr ;i rm [t j =125c] i rm q rr i f =20 a v r = 160 v t j (c) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 r th(j-a) (c/w) d2pak s cu (cm2)
STTH2002 ordering information scheme 5/10 2 ordering information scheme stth 20 02 xxx ultrafast switching diode average forward current 20 = 20 a 02 = 200 v d = to-220ac in tube di = to-220acins in tube g = d pak in tube g-tr = 2 d pak in tape and reel 2 repetitive peak reverse voltage package
package information STTH2002 6/10 3 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 nm maximum torque value: 1.0 nm table 5. t0-220ac dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
STTH2002 package information 7/10 table 6. t0-220acins dimensions ref dimensions millimeters inches min. typ. max. min. typ. max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 m 2.60 0.102 c b2 c2 f ? i l a a1 a2 b e b1 i4 l2 c1 m
package information STTH2002 8/10 figure 11. d 2 pak footprint (dimensions in mm) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 7. d 2 pak dimensions ref. dimensions millimeters inches min. max min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e 2mm min. flat zone a c2 d r a2 v2 c a1 16.90 10.30 8.90 3.70 5.08 1.30
STTH2002 ordering information 9/10 4 ordering information 5 revision history part number marking package weight base qty delivery mode STTH2002d STTH2002 to-220ac 1.90 g 50 tube STTH2002di STTH2002 to-220acins 2.30 g 50 tube STTH2002g STTH2002 d 2 pak 1.48 g 50 tube STTH2002g-tr STTH2002 d 2 pak 1.48 g 1000 tape and reel date revision description of changes 03-may-2006 1 first issue
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